The book is a detailed review of how microelectronic substrates are diced and what type of dicing machines and dicing blades are used. A review of each application end product is covered in detail. The book covers all the important dicing saws technical accuracy specs to be monitored in order to meet the diced substrates quality specs. The other side of the review covers the dicing blades technologies of the different dicing blades matrices and geometries. The dicing blades review talks about the bond technology, the manufacturing processes of the different blade types, the quality control specs and how to monitor and measure them. The major applications used in the microelectronic industries are covered in detail. This section includes the dicing saw types, dicing parameters, mounting technics, coolant designs and others. The dicing blade options used per application are discussed in detail. Some unique and difficult applications require different singulation technologies which are also covered in this unique book. The dicing saws, the blade technology and the application review are covered with detailed sketches and photos.